How do I measure conformal coating thickness?

April 13, 2017 Blog

There are several ways to measure the conformal coating thickness on a printed circuit board (PCB). They can be either used on dry or wet film coating.

These techniques include:

Non-destructive eddy current system
Micrometer screw gauge
Wet film gauge

These techniques are explored further below.

Non-destructive eddy current system

A fast method for measure coating thickness is a system using eddy currents. The process can be extremely quick and accurate to ±1 um.

Using a gauge and flying probe for the measurement the system is extremely easy to use.

The process works by placing the test probe head flat on the surface of the conformal coating and the measurement is almost instantaneous. The system provides an immediate repeatable result for thickness measurement of conformal coating.

Using a test probe system like the Positector 6000 can quickly give you conformal coating thickness measurements without damaging the circuit board.

Test coupons are the ideal method for measuring the coating thickness, whether is it spraying or dipping, and can be kept as a physical record of the performance.

Apply the coating to the test coupons at the same time as the circuit board then provides a permanent measurement and an accurate guide to the coating thickness.

There are a couple of issues using a system like this.

First, there needs to be metal in the circuit board directly below the tested point. Otherwise, the system cannot work.

Second, there needs to be a flat area large enough for the test probe. The smallest practical probe is approximately 6mm diameter so any area smaller than this is not practical.

Finally, the surface measured for the probe needs to be flat. If not then there will be errors in the measurement.

Micrometer screw gauge

The low cost method is using a calibrated micrometer screw gauge that can measure down to ± 10 um. First measure a point on the board or test coupon, apply the coating, cure and measure the test coupon again at the same point. The difference gives you the coating thickness.

A couple of pitfalls to avoid are ensuring the coating is cured hard enough since if it is soft it could compact and give a false reading. Also, do not measure one point. Take an average of at least 3 or 4 points since this will give a better result statistically.

Test coupons are the ideal method for measuring the coating thickness, whether is it spraying or dipping, and can be kept as a physical record of the performance.

Wet film gauge

A final method is a wet film measurement technique that is very cost effective.

The technique uses a comb with different size patterns that is placed in the wet coating and the imprint left indicates the wet film thickness.

Knowing the solids content of the material means that the material thickness can be calculated.

A wet film gauge is a low cost method for measuring coating thickness while the conformal coating is wet. Using the solids content in the material and the wet film thickness allows the dry film thickness to be estimated.

Need to know more about conformal coating thickness measurement?

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What are the alternative materials to liquid conformal coatings?

April 11, 2017 alternative, Atomic layer deposition (ALD), Blog, conformal coating, Molecular vapour deposition, Parylene

There are several alternative coatings available to the traditional conformal coating materials.

These alternative coatings include:

Parylene and other Chemical Vapour Deposition (CVD) films
Fluorinated ultra-thin and thin film coatings
Molecular Vapour Deposition (MVD) coatings
Atomic Layer Deposition (ALD) coatings

They can provide extremely high protection to circuit boards if used correctly for the right product.

There are several new and old alternative coatings available to the traditional conformal coating materials. They include Parylene, fluorinated Nano-coatings, Molecular Vapour Deposition (MVD) and Atomic Layer Deposition (ALD) thin films.

Parylene (XY) coatings

Parylene is the trade name for a variety of chemical vapor deposited poly(p-xylylene) polymers used as moisture and dielectric barriers.

Parylene is a conformal coating that is deposited as a gas in a vacuum chamber.

It is a dry process compared to the standard “wet” liquid conformal coatings.

Fluoropolymer (FC) coatings

Surface Modifiers are ultra thin coatings that are applied at less than a few microns in thickness.

Liquid conformal coatings are applied in the range of 25-75um so they are considerably thicker in nature.

There are several variations in ultra thin conformal coatings out in the market now but two of the most popular types are liquid materials and partial vacuum deposition.

Atomic layer deposition (ALD)

ALD belongs to the family of chemical vapor deposition methods (CVD).

It is a deposition process at a Nano-scale level within a vacuum chamber.

The deposition process forms ultra-thin films (atomic layers) with extremely reliable film thickness control.

This provides for highly conformal and dense films at extremely thin layers (1-100nm).

Molecular vapour deposition (MVD)

MVD belongs to both the families of chemical vapor deposition (CVD) and atomic layer deposition (ALD) methods.

Unlike traditional CVD and ALD flow systems the MVD reaction takes place in a chamber under static pressure resulting in extremely low chemical use.

The MVD process produces highly conformal thin film coatings, typically less than 100nm in thickness.

The coating provides excellent barrier properties and surface energy control.

Need to know more about alternative materials to the traditional liquid conformal coatings?

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Is there a free guide on conformal coating defects?

April 6, 2017 Blog, conformal coating

Nexus, the independent conformal coating information site, provide an information section on conformal coating defects in their free online Ebook.

According to Nexus, problems in conformal coating can be broken down into two areas.

Problems relating to conformal coating process
Problems relating to product reliability

In their troubleshooting section they focus on troubleshooting the problems associated with conformal coating processing and production.

You can download the PDF guide Solving conformal coating problems in the application process now.

Need to know more about conformal coating defects?

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Why does cleaning improve the adhesion of the conformal coating?

April 4, 2017 Blog

In general it is important that conformal coatings have good adhesion in order to be effective. However, there is no single theory that describes the property of adhesion for conformal coatings.

There are three basic mechanisms for conformal coatings that are known to help with good adhesion.

They are:

Adsorption
Chemical Bonding
Mechanical Interlocking

Adsorption

This is where the molecules in the conformal coating wet or flow freely over the substrate and make intimate contact with the substrate. This forms interfacial (electrostatic) bonds with van-der-Waal forces.

Any contamination between the two will weaken the adsorption. Any de-wetting (prevention of wetting) will also hinder the adsorption.

Cleaning the surface of contamination will help with adsorption.

Chemical bonds

The bonds are formed at the interface between the conformal coating and the substrate.

Good bonding gives strong adhesion of the conformal coating to the substrate. If bonding cannot be achieved due to contamination then poor adhesion may result.

Cleaning the surface of contamination will help the chemical bonding process.

Mechanical interlocking

The conformal coating film penetrates the roughness on the substrate surface and is achieved once the coating dries.

If the surface is smooth then the mechanical bonding is less effective. If the surface can be cleaned, leaving a rough surface, then more effective bonding can be achieved.

Cleaning the surface of contamination will help.

Achieving the best conformal coating adhesion

Surface contamination can be critical when considering conformal coating and the process. If you can clean the contamination from the surface then the adhesion of the conformal coating should improve.

All three mechanisms do not have to occur to form good adhesion. Depending on the specific conformal coating system, substrate, and application method, different mechanisms could work.

However, good wetting or adsorption is normally required for good bonding.

So, if in doubt clean the surface of the substrate to achieve good conformal coating bonding.

Need to know more about conformal coating adhesion?

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Are there design rules for applying conformal coatings?

March 30, 2017 Blog, Uncategorized

Conformal coating is not simply a consumable material. Unfortunately, for too many designers, conformal coating is simply a part number, to be applied to circuit boards.

However, this can be a major problem especially in the conformal coating production stage of the process.

There are guidelines in the IPC standards that may help with Design for Manufacture (DFM) principles. These are worth considering.

Unfortunately, there are no official design guidelines that will help directly with the application process and conformal coating.

Unfortunately, for too many designers, conformal coating is simply a part number, to be applied to circuit boards. However, this can be a major problem especially in the conformal coating production stage of the process.

Nexus Design Rules

Nexus, the independent conformal coating knowledge base, has developed both guidelines for conformal coating reliability and conformal coating process.

Their philosophy is that for companies embracing lean philosophies and applying conformal coatings, a failure to appreciate the subtleties of the application process can result in an uncoatable (at least as specified) assembly process.

They also state that if the rules are not followed, the resultant circuit board design can challenge even the most sophisticated conformal coating system and its operator to achieve the finish desired.

Nexus have design rules for both general processing and for specific application processes such as dipping, selective coating and batch spraying.

For further information visit conformal coating design rules to learn more.

Need to know more about conformal coating design rules?

Do you need MiL spec qualification for your conformal coating?

March 29, 2017 Blog, Uncategorized

march 28 image

Normally, customers know if they require MIL-I-46058C qualification for their conformal coating. It normally is required if it is a military product.

However, caution should be shown when examining conformal coating datasheets that state MEET the requirements of MIL-I-46058C since the conformal coating will likely not be on the Qualified Product List (QPL).

What is the Qualified Product List (QPL)?

The Mil Standard for conformal coating has been inactive for new designs since November 1998. However, the standard is still widely used for independent certification of conformal coatings.

All companies tested to the MIL-I-46058C standard are listed on the QPL. It is still possible to register the coating on the list.

Conformal coatings listed on the QPL will have been through rigorous 3rd party testing to confirm they meet the standard. They are not self-certified.

So, if you require a conformal coating material that is Mil-spec approved then it will have to be on the QPL and it will have been independently tested.

Need to know more about Mil Standard conformal coatings?

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What is plasma cleaning?

March 23, 2017 Blog, Plasma, Plasma cleaning

Plasma cleaning is a process of using plasma energy to clean and modify the surface of a substrate like a circuit board assembly.

It is a highly effective surface cleaning and treatment process before application of conformal coatings and is gaining more popularity due its highly effective performance.

What is Plasma?

Plasma is the energy-rich gas state (also known as the fourth state of matter) that can be used to modify the surface of a product to improve its performance.

Plasma technology is based on a simple physical principle.

Matter changes its state when energy is supplied to it. Solids become liquid. Liquids become gas.

If additional energy is then fed into a gas by means of electrical discharge it eventually ionises and goes into the energy-rich plasma state, plasma is created.

This modification can be improving the adhesion of a conformal coating or change the surface characteristics of the board.

How is Plasma used for improving the performance of coatings with printed circuit boards?

For electronic circuit surfaces, plasma treatment can be used in two highly effective ways.

That is it can:

Clean the surface of the circuit board. The surface will be free of residues and 100% contamination free including release agents and additives.
Activate the surface of the circuit board assembly. This will allow easier bonding and better adhesion of conformal coatings.

These properties make it an interesting technique for improving the surface performance of an electronic circuit board.

In fact, plasma treatment can clean, activate or coat nearly all surfaces. These surfaces include plastics, metals, (e.g., aluminum), glass, recycled materials and composite materials.

This means the plasma process can be highly effective on many different products.

For electronic circuits, plasma treatment can be used in two highly effective ways. First, it can clean the surface of the circuit board. Second, it can activate the surface of the circuit board assembly to allow easier bonding and better adhesion of conformal coatings and materials like Parylene.

What are the typical plasma processes available for surface treatment?

There are traditionally three types of plasma treatment:

Low-pressure plasma
Corona treatment
Atmospheric pressure plasma

Low-pressure plasma

These plasmas are generated in closed chambers in a vacuum (10-3 to 10-9 bar).

They can be used in conjunction with Chemical Vapor Deposition (CVD) coatings like Parylene before application.

Corona treatment

Corona treatment (corona process) is a physical process involving high voltage and is mainly used for treatment of films.

This is normally not suitable for electronic circuit boards.

How is the plasma applied to a circuit board to clean and activate the surface?

For materials like liquid conformal coatings then atmospheric pressure plasma is an excellent process for cleaning surfaces and improving adhesion and surface energy performance of circuit boards for conformal coatings.

Atmospheric plasma is generated under normal pressure. This means that low-pressure chambers are not required.

The plasma is created with clean and dry compressed air and does not require forming gases. It is possible to integrate plasma directly into manufacturing processes under normal pressure conditions.

Typical plasma components used for cleaning surfaces on circuits are:

Plasma jets (nozzles) to apply the plasma to the surface of the circuit board. They could be controlled by a robotic system.
The plasma generators that create the plasma to clean or supply the coatings as required. They provide output power and, in conjunction with complete pretreatment stations, assume various control functions.
The process monitoring that controls the nozzles, the movement of the system and the quality of the output.

These three parts form the plasma cleaning process.

For Chemical Vapor Deposition (CVD) coatings like Parylene then low-pressure plasma can be used in the chamber before application.

These plasmas are generated in closed chambers in a vacuum (10^-3 to 10^-9 bar).

Want to know more about plasma cleaning and conformal coating performance?

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How to clean “no clean” flux residues and get it right

March 21, 2017 Blog

Cleaning the residues left behind by a no clean flux process is one of the most difficult tasks when considering cleaning.

After all, the residues left on the circuit board are not formulated to be cleaned away easily.

How do you clean no clean flux residues if you need to?

Whether a flux residue can be cleaned effectively depends on the cleaning materials saponification factor and its compatibility with the residues.

Saponification is the ability of the no clean residues to be softened to the point of being able to be dissolved by the alkali content (the saponifier) of the cleaning chemistry. The higher the saponification factor of the cleaning fluid the easier it is to clean the residues.

So the key here is to ensure that the saponifier completely dissolves the residues.

What happens if the residues are only partially dissolved?

A no-clean residue that is only partly cleaned away may be far worse for a printed circuit board assembly (PCBA) than a no-clean residue left untouched.

One of the reasons is because lead free flux activators are more active than those in earlier leaded flux formulations.

In a no clean flux, when un-cleaned, the residues are locked up in the carrier resin matrix. They are stable (benign) at normal operational temperatures and therefore will not leach out dangerous residues and cause corrosion problems.

However, if the protective matrix around the residue is partially removed by an inadequate cleaning regime, then the activators could be exposed.

This may lead to a corrosion process starting on the circuit board. Further, this process could be accelerated in the presence of heat, power on the boards in service or high relative humidity.

So how do you clean “no-clean” residues?

It is important when considering cleaning “no-clean” residues on a circuit board that you consider three points:

Can you actually clean the residue to be cleaned effectively?
Have you matched the cleaning chemistry with the relative degree of difficulty and the available process?
Have you validated the whole process by careful testing?

Consider these three points and it may help you be successful. Not considering these three points could easily lead you to having real problems in the long term.

Want to know more about cleaning no clean fluxes or cleaning circuit boards?

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The ABCs of Atomic Layer Deposition (ALD)

March 16, 2017 Blog, Uncategorized

What is ALD?

Atomic Layer Deposition (ALD) belongs to the family of Chemical Vapour Deposition methods (CVD).

It is a deposition process at a nano-scale level within an enclosed vacuum chamber.

The deposition process forms ultra-thin films (atomic layers) with extremely reliable film thickness control.

This provides for highly conformal and dense films at extremely thin layers (1-100nm).

What coatings are deposited in ALD?

ALD principally deposits metal oxide ceramic films.

These films range in composition from the most basic and widely used aluminum oxide (Al2O3) and titanium oxide (TiO2) up to mixed metal oxide multilayered or doped systems.

How does ALD work in practice?

The ALD deposition technique is based upon the sequential use of a gas phase chemical process.

Gases are used to grow the films onto the substrate within a vacuum chamber.

The majority of ALD reactions use two chemicals called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner.

Through the repeated exposure to alternating gases there is a build up of a thin coating film.

Where is ALD used?

ALD is used in many different areas including:

Micro-electronics
Semiconductors
Photovoltaics
Biotechnology
biomedical
LEDs
Optics
Fuel cell systems

Advantages and disadvantages of ALD

Advantages

Self-Limiting. The ALD process limits the film thickness. Many other processes like Parylene are dependent upon amount of dimer and will continue to deposit successive polymer layers until it is completely used up.
Conformal films. ALD film thickness can be uniform from end to end throughout the chamber. Other coatings like Parylene can have a varied coating thickness across the chamber and the devices being coated.
Pinhole free. ALD films can be pinhole-free at a sub-nanometer thickness. Parylene and some other materials are only pinhole-free at micron levels.
ALD allows layers or laminates. Most other films including Parylene are single component layers.

Disadvantages

High purity substrate. This is very important to the quality of the finish similar to many other vapour deposition processes.
ALD Systems can range anywhere from $200,000 to $800,000 based on the quality and efficiency of the instrument. This tends to be 3-4 times the prices of a Parylene system.
Reaction time. Traditionally, the process of ALD is very slow and this is known to be its major limitation.
Masking challenges. The ALD masking process must be perfect. Any pinhole in the masking process will allow deposition beyond the masking barrier.

What are some of the ALD coatings that can be deposited?

A wide variety of chemistries are possible with Atomic Layer Deposition.

They include:

Oxides
Nitrides
Metals
Carbides
Sulfides

Want to know more about Atomic Layer Deposition (ALD) coatings?

Contact us now!

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Introducing a new coating that could offer the ultimate protection for LEDs without compromise to performance or process cost

March 14, 2017 Blog

The need to protect LEDs from the long –term exposure of a harsh environment is becoming more and more required. This is doubly so for LEDs used outdoors.

The alternative coatings used to protect LEDs are many. They include Parylene, conformal coatings, ultra-thin fluoropolymer materials and encapsulates.

However, none of the material processes offer the perfect protection without adding significant cost to the production process, and ultimately the circuit board and product.

Further, to reduce costs in production some of the coating materials used compromised performance. So, there is a typical balance of costs versus protection.

Now, this may all change with the introduction of a very new coating process that takes many of the performance benefits of the best coatings but does not suffer the associated problems of increased production costs.

This process is a hybrid ALD (Atomic Layer Deposition)/CVD (Chemical Vapor Deposition) technique.

So what is a Hybrid ALD / CVD technique?

Most people in conformal coating have heard of Parylene. Parylene is a CVD (chemical vapor deposition) process where the Parylene material is applied in a vacuum chamber and the coating builds up on the surface of the circuit.

The new hybrid process uses CVD as one of its film processes. However, how it differs is that the method also uses another technique, ALD (atomic layer deposition).

Further, these two processes, ALD and CVD are applied sequentially. They are deposited as ultra-thin coatings (nanometer scale thickness) one on top of the other.

This build up of multiple layers of ultra-thin coatings (alternating ALD and CVD films) with differing coating properties produces a completely different hybrid coating that outperforms the individual coatings produced by ALD and CVD alone.

Further, the final layer applied is a hydrophobic barrier that further enhances the performance of the coating.

So how does the hybrid film differ to traditional materials like Parylene and liquid conformal coatings for protecting LEDs?

First, the hybrid coatings protective performance has been found to be superior to them all in most categories of testing so far. It provides both improved electrical and physical properties that protect the circuits.

A major issue for LEDs is light loss when the film is applied over the LEDs. For the hybrid coating the coating shows zero loss of light and this is a great advantage.

Also, the material is both temperature and UV stable. The coating will survive up to 350C and does not degrade in UV light. Again, these are great advantages for the performance of the hybrid coating.

It is also hydrophobic. This property rejects water from the surface and improves the film properties enormously.

However, what makes this coating exceptional is its final property. That is the coating does not require the circuit board to be masked when the coating is being applied!

So, why does the hybrid film not need masking like other traditional conformal coatings and Parylene?

The difference is film thickness.

The hybrid film is much thinner than the other traditional coatings including Parylene. Typical film thicknesses can be as low as 0.1um.

Since the coating is extremely thin (<< less than traditional coatings) then it has been found that no masking is required.

This is because when components like connectors are joined together then the ultrathin coating does not prevent electrical connection. The component mating parts connect together and no loss of connection can be measured.

Even better, the physical protection of the film is not compromised. In fact, all of the components including connectors are protected.

This means that the cost of process is purely the cost of application of the material and nothing else.

Since the process is relatively low cost then this does offer a very interesting alternative to the traditional coating materials in LED processing.

Doesn’t the hybrid ALD / CVD process sound complex to operate?

Actually, although the technology and chemistry can be a little complex the process itself is fairly simple.

Once the process is set up in the machine the operator just loads, switches the machine on, waits for the coating to be applied and unloads on completion.

This is a far cry from the sophisticated processes of robotic selective coating or the challenges of Parylene. Further, the application process is actually very stable and in reality is tried and test in other industries for a long time.

So, how well did the hybrid coating perform in protecting the LEDs?

Nexus, an online conformal coating database, actually worked with live LED circuits from a customer and tested the hybrid ALD / CVD material.

The customer LED product was an outdoor application. The LED customer used their own in-house test methods to prove the technology.

As part of the testing the LED circuit was exposed to tests for resistance against salt, moisture and temperature.

The test methods included:

Initial test submerged in DI water dip for 12 hours
Second test submerged in 25% concentration saltwater dip for 17 hours
Third test 2 x 6 hour cycles in water ramped from room temperature to 70°C

After each test the boards were tested for failure or problems.

The LED circuit passed on all tests. All results achieved were completed with no masking of components and zero light loss in LED opacity.

The electrical connections were found to be excellent and the coating did not affect the integrity of the connectors.

So what about the cost of process?

Since the hybrid film process is masking and de-masking free then the cost per unit is incredibly low. This makes the material superior to nearly all the traditional methods of coating protection.

Further, the protective properties of the hybrid coating in nearly all cases is superior to the conventional methods.

So, you get a lower cost coating with a higher technical performance.

So, just how good is the hybrid ALD / CVD coating as a protective material for electronics?

Generally, with protective coatings for electronics then Parylene is considered the gold standard in most cases.

So, Nexus compared Parylene with the hybrid ALD / CVD material.

Property	Parylene	ALD/CVD Coating
Hardness	Soft	Hard
Wear resistance/Handling Ease	Poor	Excellent
Water Vapor Transmission Rate	Good	Excellent
Temperature Resistance (extended time)	100°C	350°C
Color	Gray/white	Clear
Adhesion to various materials	Poor	Excellent
Scalable to large production	Poor	Excellent
Process Time	8 – 12 hrs	8 – 12 hrs
Hydrophobicity	Good	Good – Excellent
Cost	High	Low – Med

Table courtesy of Nexus

What Nexus also identified for the material were some key properties for LEDs.

The Water Vapor Transmission Rate (WVTR) is superior to Parylene so the coating is far more waterproof for the LEDs
Coating adhesion is superior as it covalently bonds to the substrate. So, the lifetime of the material will be better on the circuit.
The hybrid coating is UV stable whereas Parylene in general is not. This is an important criteria for coatings exposed outside on LEDs
The coating stayed 100% transparent during testing (no loss of lux). That again is important for LEDs.
The coating thickness of the hybrid material is x10 LESS than the Parylene. This aids light transmission and electric connectivity
The film is hydrophobic so repels water and aids the performance of the coating.

So, in reality the hybrid ALD / CVD material could just be what the LED industry is looking for in protecting their circuits.

Nexus will be performing further tests on the material to see how it performs on other types of circuits shortly.

Need to find out more?

For further information on the hybrid ALD / CVD materials then contact us directly. We can help you trial the coating.

Or, check out the Nexus article, Coating LEDs with a hybrid ALD / CVD Process.

Call us on +44 (0) 1226 249019, email your requirements on sales@schservices.com

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