The stencil cleaning system is extremely simple to use:

1. The stencil is placed flat on a surface with disposable wipe material underneath the apertures.
2. The operator sprays the stencil with cleaning fluid.
3. They move the hand tool over the stencil after spraying
4. The transducer in the hand tool vibrates the contamination in the stencil through even the smallest stencil apertures.
5. The residues are collected on disposable wipe material under the stencil.

• Most effective process. Direct contact ultrasonic cleaning is the most effective way to remove lead free solder paste residues from fine pitch stencils. This improves process yields, particularly on fine pitch applications.
• Versatile. The system is suitable for cleaning all printable materials, including pastes, inks, resists and SMD adhesives when using the correct solvent for each.
• Cost effective. The process ensures minimal use of cleaning fluids. Therefore, there are lower costs in production and less VOC’s.
• Superior technology. Advanced transducer auto-tuning system gives optimum cleaning performance on all applications however the pressure is applied to the head. Other systems sub-modulate the output causing damaging vibration.
• Flexible system. The system is suitable for both offline and on printer cleaning operations. The system is portable and can be easily moved between work areas or printers.
• In-situ cleaning. Stencil cleaning can be carried out on the printer without removing the stencil frame by placing a cleaning pad under the stencil and clearing the blockage with the hand tool.
• Compatible. Suitable for all stencil materials including plastic. No risk of damage to delicate Stencils.
• Simple operation. The system requires no operator setting.
• Affordable. The system has a low acquisition cost.
• Multi-use. An optional ultrasonic mini-bath is available which extends the versatility by allowing cleaning of machine accessories such as placement nozzles, glue dispensing needles and test probes etc.
• Safe to use. The system uses low voltage, high efficiency transducer drive circuitry. This means it conforms fully to the EU Machinery directive.
• Light weight and robust. The system is easily transported for workplace portability and is a rugged industrial construction for long service life.

Options