Atomic Layer Deposition (ALD) is an advanced thin-film coating technology used where extreme thickness control, conformality, and film integrity are required at the nanometre scale. It is increasingly specified for high-reliability electronics, semiconductor devices, optics, energy systems, and biomedical components where conventional coating methods reach their technical limits.

Unlike liquid-applied coatings or conventional vapour deposition processes, ALD builds coatings one atomic layer at a time through a self-limiting surface reaction. This allows engineers to precisely define film thickness, composition, and uniformity—even on complex 3D structures, high-aspect-ratio features, and densely packed devices.

The FAQs below provide a practical overview of:

• What ALD is and how it differs from other CVD-based coating processes
• The types of materials that can be deposited using ALD
• How the ALD process works in practice
• Where ALD is typically used across different industries
• The key advantages and limitations of ALD compared with alternative coating technologies

This section is intended to give engineers, designers, and procurement teams a clear understanding of when ALD is technically justified and how it fits alongside other advanced coating solutions such as Parylene and liquid conformal coatings.

What is ALD?

Atomic Layer Deposition (ALD) belongs to the family of Chemical Vapour Deposition methods (CVD).

• It is a deposition process at a nano-scale level within an enclosed vacuum chamber.
• The deposition process forms ultra-thin films (atomic layers) with extremely reliable film thickness control.
• This provides for highly conformal and dense films at extremely thin layers (1-100nm).

What coatings are deposited in ALD?

ALD principally deposits metal oxide ceramic films. These films range in composition from the most basic and widely used aluminum oxide (Al2O3) and titanium oxide (TiO2) up to mixed metal oxide multilayered or doped systems.

How does ALD work in practice?

The ALD deposition technique is based upon the sequential use of a gas phase chemical process.

• Gases are used to grow the films onto the substrate within a vacuum chamber.
• The majority of ALD reactions use two chemicals called precursors.
• These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner.
• Through the repeated exposure to alternating gases there is a build up of a thin coating film.

Where is ALD used?

ALD is used in many different areas including:

• Micro-electronics
• Semiconductors
• Photovoltaics
• Biotechnology
• biomedical
• LEDs
• Optics
• Fuel cell systems

What are the Advantages and disadvantages of ALD

Advantages

• Self-Limiting. The ALD process limits the film thickness. Many other processes like Parylene are dependent upon amount of dimer and will continue to deposit successive polymer layers until it is completely used up.
• Conformal films. ALD film thickness can be uniform from end to end throughout the chamber. Other coatings like Parylene can have a varied coating thickness across the chamber and the devices being coated.
• Pinhole free. ALD films can be pinhole-free at a sub-nanometer thickness. Parylene and some other materials are only pinhole-free at micron levels.
• ALD allows layers or laminates. Most other films including Parylene are single component layers.

Disadvantages

• High purity substrate. This is very important to the quality of the finish similar to many other vapour deposition processes.
• ALD Systems can range anywhere from $200,000 to $800,000 based on the quality and efficiency of the instrument. This tends to be 3-4 times the prices of a Parylene system.
• Reaction time. Traditionally, the process of ALD is very slow and this is known to be its major limitation.
• Masking challenges. The ALD masking process must be perfect. Any pinhole in the masking process will allow deposition beyond the masking barrier.

What are some of the ALD coatings that can be deposited?

A wide variety of chemistries are possible with Atomic Layer Deposition. They include oxides, nitrides, metals, carbides and sulfides.

Want to know more about Atomic Layer Deposition (ALD) coatings?

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