Three key reasons to use a Molecular Vapor Deposition (MVD) process to protect a circuit board instead of conformal coatings


Molecular Vapour Deposition (MVD) is a new process introduced to the electronics coating market.

MVD is a hybrid coating technique using ALD (Atomic Layer Deposition) and CVD (Chemical Vapor Deposition) coating processes in combination.

The method uses multiple layers of ultra-thin coatings with differing properties to build a completely protective coating with a final hydrophobic Nano coating as a top layer.

MVD

Here are three key points that strongly suggest you should find out more about this coating:

  1. The physical and electric performance of the MVD coating is superior to other materials like conformal coatings and Parylene. Parameters such as Water Vapor Transmission Rate (WVTR), hydrophobicity, coating adhesion, dielectric strength and temperature performance (>250°C) are vastly improved when protecting circuit boards.
  2. The MVD coating does not require masking to protect sensitive components and electric connectivity in connectors is easily made even when coated. This is because the coating thickness of the MVD material is x10 less than that of Parylene.
  3. The cost of process is much lower than all other protective materials due to the fact that raw ingredients are low cost and no masking is required.

There are many other performance criteria that make this material a really interesting process that could change perceptions.

For further reading try the Nexus Blog articles

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What are the alternative materials to liquid conformal coatings?


There are several alternative coatings available to the traditional conformal coating materials.

These alternative coatings include:

  • Parylene and other Chemical Vapour Deposition (CVD) films
  • Fluorinated ultra-thin and thin film coatings
  • Molecular Vapour Deposition (MVD) coatings
  • Atomic Layer Deposition (ALD) coatings

They can provide extremely high protection to circuit boards if used correctly for the right product.

There are several new and old alternative coatings available to the traditional conformal coating materials. They include Parylene, fluorinated Nano-coatings, Molecular Vapour Deposition (MVD) and Atomic Layer Deposition (ALD) thin films.
There are several new and old alternative coatings available to the traditional conformal coating materials. They include Parylene, fluorinated Nano-coatings, Molecular Vapour Deposition (MVD) and Atomic Layer Deposition (ALD) thin films.

Parylene (XY) coatings

Parylene is the trade name for a variety of chemical vapor deposited poly(p-xylylene) polymers used as moisture and dielectric barriers.

Parylene is a conformal coating that is deposited as a gas in a vacuum chamber.

It is a dry process compared to the standard “wet” liquid conformal coatings.

Fluoropolymer (FC) coatings

Surface Modifiers are ultra thin coatings that are applied at less than a few microns in thickness.

Liquid conformal coatings are applied in the range of 25-75um so they are considerably thicker in nature.

There are several variations in ultra thin conformal coatings out in the market now but two of the most popular types are liquid materials and partial vacuum deposition.

Atomic layer deposition (ALD)

ALD belongs to the family of chemical vapor deposition methods (CVD).

It is a deposition process at a Nano-scale level within a vacuum chamber.

The deposition process forms ultra-thin films (atomic layers) with extremely reliable film thickness control.

This provides for highly conformal and dense films at extremely thin layers (1-100nm).

Molecular vapour deposition (MVD)

MVD belongs to both the families of chemical vapor deposition (CVD) and atomic layer deposition (ALD) methods.

Unlike traditional CVD and ALD flow systems the MVD reaction takes place in a chamber under static pressure resulting in extremely low chemical use.

The MVD process produces highly conformal thin film coatings, typically less than 100nm in thickness.

The coating provides excellent barrier properties and surface energy control.


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